Welcome to SQP International - printed circuit board prototypes producer - expert in high quality and express deliveries.


Definitions: 
Tg - Glass Transition Temperature Temperature point at which a glassy solid changes to an amorfous resin / epoxy

- if temperature exceeds Tg:
1. expansion of the material is growing rapidly in the direction of Z axis
2. mechanical material properties degrade rapidly (strength, bonds in the material)  
Td - Decomposition Temperature - temperature at which there is a 5% weight loss of resin / epoxy

- if temperature exceeds Td:
1. irreversible destruction in material occurs due to breach of chemical bonds in resin / epoxy
T260/T288 Measures time to delamination at specific temperature (i.e. 260°C/288°C) 
CTE – Coefficient of Thermal Expansion - dimensional increasing of the material in the X-, Y-and Z-axis by change of  temperature at a constant pressure
CAF – Conductive Anodic Filament - migration of copper ions through an enclosed moisture in the material, which can over time cause a short circuit

 

Material Specifications

Material Product
   Standard Epoxy Laminates Thermal Reliable Epoxy Laminates
   Isola DE 104 Isola IS410 Isola 370HR IT-180A
IPC-4101C Spec 21 21/24/26/28/121/124 21/24/26/98/99/101 99/101/126
Tg Glass Transition Temperature by DSC, spec minimum 130 175 175 175
Td Decomposition Temperature @ 5% wt loss 330 350 340 350
T260 Mins 60 50 60 > 60
T288 Mins >5 >10 30 > 30
CTE, Z-axis Pre Tg 50 65 45 40
CTE, Z-axis Post Tg 250 250 230 210
CTE, Pre X, Y 13 13/14 13/14 10-13
CTE, Post Tg X, Y 14 15/17 14/17 10-13
% Z-Axis Expansion (50-260C) 3 3.5 2.8 2.3
Thermal Conductivity 0.4 0.5 0.4 0.4
Thermal Stress 10 Sec @ 288°C (550.4°F), spec min pass pass pass pass
Permittivity (Dk) 100 MHz HP4285A 4 3.96 4.24 4.3
Permittivity (Dk) 1 GHz HP4291A 4 3.9 4.17 4.3
Permittivity (Dk) 2 GHz Bereskin Stripline 4 3.97 4.04 4.1
Permittivity (Dk) 5 GHz Bereskin Stripline 4 3.87 3.92 4
Permittivity (Dk) 10 GHz Bereskin Stripline 3.59 3.87 3.92 4
Loss Tangent (Df) 100 MHz HP4285A 0.02 0.0149 0.015 0.013
Loss Tangent (Df) 1 GHz HP4291A 0.02 0.0189 0.0161 0.013
Loss Tangent (Df) 2 GHz Bereskin Stripline 0.022 0.02 0.021 0.013
Loss Tangent (Df) 5 GHz Bereskin Stripline 0.02 0.023 0.025 0.014
Loss Tangent (Df) 10 GHz Bereskin Stripline 0.02 0.023 0.025 0.015
Volume Resistivity (After moisture resistance) 1.3x108 5.0x108 3.0x1010 3x1010
Volume Resistivity (At elevated temperature) 3.4 x103 3.6 x105 7.0 x108 5x1010
Surface Resistivity (After moisture resistance) 1.0x108 8.0x105 3.0x108 3.0x1010
Surface Resistivity (At elevated temperature) 7.0x108 4.5x108 2.0x108 4x1010
Dielectric Breakdown, spec minimum >50 >50 >50 60
Arc Resistance, spec minimum 120 129 115 125
Electric Strength, spec minimum (Laminate & prepreg as laminated) 54 (1350) 44 (1100) 54 (1350) 45
Comparative Tracking Index (CTI) 3 [175 - 249] 3 [175 - 249] 3 [175 - 249] 3 [175 - 249]
Peel Strength Low profile Cu foil, very low profile u2013 all Cu >17um 6.5(1.14) 7 (1.23) 6 (1.05) 5.0 (0.88)
Peel Strength Standard profile copper - After thermal stress 7 (1.23) 7 (1.23) 9 (1.58) 7 (1.23)
Peel Strength Standard profile copper - At 125°C (257°F) 6.5(1.14) 6.5(1.14) 7 (1.23) 6 (1.05)
Peel Strength Standard profile copper - After process solutions 7 (1.23) 7 (1.23) 9 (1.58) 6 (1.05)
Flexural Strength Lengthwise direction 89.00 79.00 90.00 68.15-72.50
Flexural Strength Crosswise direction 70.00 68.00 77.00 60.90-65.25
Moisture Absorption, spec maximum 0.3 0.2 0.15 0.12
Flammability (Laminate & prepreg as laminated), spec min V0 V0 V0 V0
HWI 0     0
Max Operating Temperature (MOT) 130 130 (150) 130 (150) 130
DSR yes yes yes yes

 

Standard build-up:

 

Standard Laminate Thickness exclusive copper (Multilayer) on stock

Thickness

 Isola DE104 Isola IS410 Isola PCL370HR ITEQ IT-180A
   18/18 35/35 70/70 18/18 35/35 70/70 18/18 35/35 70/70 18/18 35/35 70/70
0.15
0.20
0.36
0.41
0.46
0.54
0.56
0.61
0.71
1.000

 

Standard Rigid thickness (thickness is copper inclusive) on stock

Thickness

 Isola DE104 Isola IS410 Isola PCL370HR ITEQ IT-180A
   0/35 18/18 35/35 70/70 0/35 18/18 35/35 70/70 0/35 18/18 35/35 70/70 0/35 18/18 35/35 70/70
1.00
1.20
1.50
1.55
1.60
2.00
2.40
3.20

 

Standard Prepregs on stock
   Isola DE104 Isola IS410 Isola PCL370HR ITEQ IT-180A
Type M V M V M V M V
106
1080
2116
2125
7628 01
7628 97

 

Prepregs thickness
  Type Isola DE104 Isola IS410 Isola PCL370HR ITEQ IT-180A
106 57 µm 49 µm 50 µm  
1080        
2116 118 µm 104 µm 117 µm  
2125 104 µm      
7628 01 197 µm      
7628 97 221 µm      

 

Copper Foils on stock
   Foil
  Punched Unpunched
Thickness [µm]  M V M V
5
12
18
35  
70

 

DRILLING AND ROUTING
Min drill diameter: 0.2 mm (PTH 0.15 mm)
Max drill diameter: 6.0 mm (PTH 5.9 mm)
Min router: 0.8 mm
Standard router:  1.6 mm
Routing: PCBs with max dimensions under 30 mm are finalized only with break outs.
For a non-standard drilling density as well as for a non-standard routing on the board we reserve the right to change the overall price, i.e. drilling and routing have a fundamental influence on the PCB price. Example: Universal PCB

 

TRACK AND GAP SIZE
Standard track and gap size: 0.15 mm
Minimum track and gap size: 0.10 mm

 

SOLDER MASK & SILKSCREEN COLORS 
Color Selection: Green, Blue, Red, White, Black (standard: green solder mask/white silkscreen) XV501T family
Green Soldermask Color: Curtain Coat, Printable
Other Soldermask Color: Printable

 

SURFACE TREATMENT
Surface treatment:
  • HAL Felder Sn (lead free HAL)
  • HAL SnPb
  • NiAu (Ni 5 µm,Au 0.1 µm)

*  for thicknesses 0.2 - 0.25 mm and for thicknesses over 3 mm NiAu only

 

ELECTRICAL TEST:
PROBOT 6D SERIES
Continuity: Voltage  3 V
Current 12 mA
  Resistance 40 Ohm
 Discontinuity : Voltage 150 V
   Resistance 10 MOhm
ATG A2 PROBE TESTER
Continuity: Voltage  3 V
Current 12 mA
  Resistance 40 Ohm
 Discontinuity : Voltage 150 V
   Resistance 10 MOhm
ATG A 1500
Continuity: Voltage 100 V
Current 40 mA
  Resistance 30 Ohm
 Discontinuity : Voltage 100 V
  Resistance 10 MOhm

 

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UL file number: E258735
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